ビウィン

K4A8G085WG Samsung Flash Memory ICs K4A8G085WG-BCWE

W664GG6RB IC DRAM 4GB DDR4 1.2V SDRAM X16 1600MH POD12 96VFBGA

The industrial-grade SLC NAND Flash storage, makes up for the low capacity, high price and low speed of SPI NOR Flash

LPDDR (stands for Low Power Double Data Rate) SDRAM is a kind of DDR, being mainly characterized by its Low Power consum

DMMC solution adopts a highly integrated design by adding a low-power controller to the NAND flash

eSSD is an embedded solid state driver solution designed in the form of TFBGA packaging

BIWIN UFS Chips is a next-generation embedded memory chip

BIWIN ePOP Chips combines MMC and Mobile LPDDR in a single package with different capacities

BIWIN eMCP Chips is based on MCP (Multi-Chip Packaging) which integrates an eMMC chip and a low-power DRAM solution into